---
title: "Senior/Staff Process Engineer (Wafer Dicing & Back-grind)"
company: "Lumilens"
company_url: "https://www.remjobs.works/companies/lumilens"
url: "https://www.remjobs.works/job/lumilens-senior-staff-process-engineer-wafer-dicing-back-grind-a4ee5300-1b64-4266-8343-ee0ce4299fda"
apply_url: "https://jobs.ashbyhq.com/lumilens/12f8ffb4-4583-42d3-9e86-9f04984b6b0a"
workplace: onsite
location: "Singapore"
employment_type: full-time
seniority: staff
role: software-engineering
region: asia-pacific
date_posted: 2026-09-11T07:47:21.101Z
first_seen_by_remjobs: 2026-09-15T19:02:43.396Z
---

# Senior/Staff Process Engineer (Wafer Dicing & Back-grind)

**Lumilens** · Singapore

Apply: https://jobs.ashbyhq.com/lumilens/12f8ffb4-4583-42d3-9e86-9f04984b6b0a

## About the role

**Core Responsibilities**

- Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.

- Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers.

- Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage.

- Monitor wafer thickness uniformity, cutting quality and production capacity, carry out continuous process optimization to improve product yield.

- Evaluate process compatibility between wafer grinding/stealth dicing and bumping & flip-chip processes, optimize process integration to avoid subsequent process failure attributed to front-end process variations.

- Compile process SOP, WI, failure reports and engineering change documents; support NPI new product introduction and process verification.**
Key Requirements & Qualification**

- Education: A Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline

- Experience: 3 to 6+ years of hands-on process engineering in wafer mounting, wafer dicing, wafer thinning or grinding, especially in handling advanced packaging wafers with more complex topology or stack

- Experience working with external equipment and material suppliers to develop equipment and materials needed to support new assembly requirements. Characterize, qualify and bring the process up for mass production

- Familiarity with SPC, JMP data analysis, and DOE matrix design for process development and problem identification and solving using meticulous fixing methods

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Source: Lumilens's own career page, read by RemJobs. Canonical HTML version: https://www.remjobs.works/job/lumilens-senior-staff-process-engineer-wafer-dicing-back-grind-a4ee5300-1b64-4266-8343-ee0ce4299fda